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Senior Density Fill Development Engineer

US, Oregon, Hillsboro💼 Full-time💰 $128,880–$128,880🗓 2026-08-17 → 2026-09-25

Core

Design, develop, and debug Fill components of Process Design Kits (PDKs) and provide algorithmic solutions to address density deficiencies and ensure manufacturability compliance for Intel's hardware product design and manufacturing processes.

Role type

Senior IC EDA Tools Software Engineer (Density Fill)

Builds

Process Design Kits (PDKs) and physical verification rule decks for advanced semiconductor nodes

Domain

Semiconductor manufacturing / Physical Verification / Design Automation

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Physical verification platforms (Calibre, ICV, Pegasus), SVRF/TVF/PXL/PVL/PVTCL rule deck development, semiconductor device physics, algorithmic solutions for physical design, Unix/Linux environments

Preferred skills

Density fill methodologies at 16nm and below, advanced physical verification techniques (DRC, density/fill modules), custom layout tools (Cadence Virtuoso, Synopsys Custom Designer), technology scaling challenges, cross-functional collaboration

Technologies

Calibre, ICV, Pegasus, SVRF, TVF, PXL, PVL, PVTCL, Cadence Virtuoso, Synopsys Custom Designer

Responsibilities

Design and debug Fill components of PDKs; Provide algorithmic solutions for density deficiencies; Collaborate with process developers and design rule owners; Automate workflows for design teams; Develop test cases to validate software tools; Partner with cross-functional teams and external EDA vendors; Maintain documentation and training materials

Seniority

Senior, hands-on IC

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