Advanced Packaging Senior Yield Analysis
Core
Drive yield and defect improvement across advanced packaging technologies by analyzing manufacturing data, test content, and inline metrology to fix process issues.
Role type
Senior IC yield analysis engineer (advanced packaging)
Builds
High-volume manufacturing packaging solutions for semiconductor clients
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | dashboards & analysis
Required skills
statistical analysis, data mining, JMP, Python, data visualization, inline defect metrology knowledge, electrical/physical fail correlation, cross-functional collaboration
Preferred skills
structured technical problem-solving, product design/circuit architecture understanding, statistical analysis expertise
Technologies
JMP, Python, Databases, Datamining tools
Responsibilities
Synthesize large volumes of structured and unstructured data to extract insights; Develop solutions to yield problems using statistical methods and manufacturing knowledge; Drive recommendations and influence the yield improvement roadmap; Prepare detailed reports on yield and device health; Partner with Process Engineering, Integration, and Test Development teams; Support technology development and ramp into high-volume manufacturing (HVM).
Seniority
Senior, hands-on IC with leadership responsibilities
