Principal Engineer, Module Development – CMP
Core
Lead CMP module development strategy, process optimization, and high-volume manufacturing readiness for advanced logic technologies (18A, Intel 3, 12nm).
Role type
Principal Engineer, Module Development (CMP)
Builds
Scalable, manufacturable CMP solutions for Intel Foundry customers and internal product teams.
Domain
Semiconductor manufacturing / Chemical Mechanical Planarization (CMP)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP process development and optimization, CMP equipment and consumables expertise, structured data-driven root-cause analysis, process integration knowledge, CMP process control and metrology familiarity
Preferred skills
Advanced technology node experience (sub-10nm, GAA), supplier collaboration for process tuning, cross-functional leadership in yield excursions and defect reduction, mentoring capability, ownership mindset, fast-paced environment adaptability, semiconductor foundry background
Technologies
CMP tools, CMP consumables, metrology equipment
Responsibilities
Lead CMP module development strategy and execution across multiple technology nodes, Own technical direction for CMP process optimization and qualification, Drive defect reduction and yield improvement initiatives, Partner with cross-functional teams to resolve complex manufacturing issues, Develop solutions aligning module performance across development and manufacturing, Lead cross-functional problem-solving for variability reduction, Evaluate technical inputs to define strategic responses, Engage with suppliers to optimize CMP processes, Provide technical leadership in process control and device performance impacts, Mentor junior engineers, Communicate technical findings to leadership, Drive execution while maintaining safety and quality compliance
Seniority
Principal, strategic technical leadership and cross-functional influence
