Hardened Microelectronics Science & Technology Lab Fellow
Core
Lead Science and Technology efforts for Hardened Microelectronics, aligning engineering development with corporate strategy and external DoD programs.
Role type
Senior IC/Lead Hardened Microelectronics Scientist & Strategist
Builds
Advanced ASIC designs, 3D/HI packaging, embedded cyber-physical security, anti-tamper systems, and radiation-hardened solutions for extreme environments.
Domain
Defense & Space, Microelectronics, Radiation Hardening
Deliverable
production ML models | product features | research | client delivery | infrastructure
Required skills
Strategic planning, technical leadership, proposal development, program management, risk mitigation, advanced ASIC design knowledge, 3D/HI packaging expertise, embedded security, radiation hardening, fabrication collaboration
Preferred skills
Nationally recognized Subject Matter Expert status, ability to advance State of the Art solutions
Technologies
ASIC design, 3D/HI packaging, embedded cyber-physical systems
Responsibilities
Drive solutions to complex multidisciplinary problems, shape customer requirements for challenging technical programs, lead and mentor large technically diverse teams, support external program capture with DoD and commercial partners, shape technology offerings to open new business areas, analyze strategy to build key capabilities, identify and mitigate cross-program risks
Seniority
Senior, hands-on IC with strategic oversight
