CareerPlan

Director Design Engineering

Richardson, USFull-time$191k–$332k2026-10-26 → 2026-11-09

Core

Lead the development and execution of complex SoC, AI/ML, networking, compute, or edge-processing products from concept through tape-out and productization.

Role type

Director of Design Engineering (Senior IC)

Builds

ASIC/SoC silicon solutions for advanced semiconductor technologies

Domain

Semiconductor / SoC Design / Front-end Design

Deliverable

production ML models

Required skills

SoC architecture, RTL design, Microarchitecture development, Synthesis, CDC/Lint, DFT, Timing closure, Design verification, PPA optimization, Chiplet integration, 2.5D/3D packaging, AI-driven design flows

Preferred skills

Advanced technology nodes (7nm, 5nm, 3nm), AI/ML accelerators, High-performance computing, Low-power design methodologies, System-level optimization

Technologies

RTL, GDSII, EDA tools, PDK, IP, 2.5D/3D packaging

Responsibilities

Lead design and execution of complex SoC programs; Drive front-end development from architecture to tape-out; Build and mentor high-performing design teams; Partner with cross-functional teams and customers; Define and execute design strategies for advanced technologies.

Seniority

Director, hands-on IC with management