Director PostFab Engineering
Core
Lead the development and industrialization of advanced packaging solutions for next-generation silicon photonics and optical interconnect products.
Role type
Director of Advanced Packaging Development
Builds
Advanced packaging solutions for silicon photonics, optical interconnects, and co-packaged optics
Domain
Semiconductor manufacturing / Silicon photonics / Optical interconnects
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (Advanced Packaging Solutions)
Required skills
Advanced packaging architecture, flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, reliability qualification, OSAT management, strategic customer engagement, technology roadmap definition, cross-functional program execution
Preferred skills
Silicon photonics, optical engines, hyperscale networking, AI/datacenter applications, scaling engineering organizations
Technologies
Flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects
Responsibilities
Lead advanced packaging development organization and define technology roadmaps; Drive technology decisions on design, materials, and manufacturability; Engage directly with customers and OSATs to shape product strategies; Lead cross-functional execution for product scale-up and commercialization; Manage external partnerships for joint development and manufacturing readiness.
Seniority
Director, strategic leadership & organization building
