Senior Optical Packaging Process Engineer
Core
Developing and optimizing high-precision optical packaging processes for photonic modules, focusing on active alignment, process development, and New Product Introduction.
Role type
Senior Optical Packaging Process Engineer
Builds
High-precision photonic modules and optical components
Domain
Silicon photonics / Semiconductor manufacturing / Quantum computing hardware
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Active alignment process development, Optical module packaging qualification, NPI (New Product Introduction), DFM/DFR, Optical coupling efficiency characterization, Mechanical tolerance analysis, Thermal performance optimization, Root cause analysis (8D), Yield and quality metrics development, FAU/optical connector to chip attachment, Fiber attach tooling and process flow development
Preferred skills
Semiconductor OSAT vendor experience, Equipment selection and qualification, Process documentation (PFMEA, control plans), Vendor collaboration, Optical data analysis
Technologies
Fiber arrays, Optical fibers, Semiconductor packaging tools, FAU (Flip-chip Attach Underfill), Optical connector to chip attachment
Responsibilities
Develop, validate, and optimize active alignment processes for high-precision optical components; Lead process development and qualification for optical module packaging; Support NPI efforts including DFM and DFR; Design and execute experiments to characterize optical coupling efficiency, mechanical tolerances, and thermal performance; Drive root cause analysis of yield/reliability issues; Develop process documentation and train technicians; Collaborate with vendors and stakeholders on materials, tools, and automation; Participate in equipment selection, installation, and qualification for process scaling
Seniority
Senior, hands-on IC