RF Technology Development Integration Engineer – Principal Engineer
Core
Develop, optimize, and qualify FEOL and BEOL semiconductor devices and processes for RF technology, focusing on performance, cost, and yield.
Role type
Principal RF Technology Development Integration Engineer
Builds
RF semiconductor devices and processes for global manufacturing
Domain
Semiconductor manufacturing (FEOL/BEOL), RF technology, Silicon/SiGe BiCMOS
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process development, CMOS device physics, DC and RF device characterization, S-parameter analysis, noise figure analysis, loadpull analysis, DOE design and execution, simulation, test structure design, test methodology development
Preferred skills
High frequency design, layout and simulation tools (e.g., Cadence), project management, technical leadership
Technologies
FEOL, BEOL, Silicon, SiGe BiCMOS, S-parameter, noise figure, loadpull, Cadence
Responsibilities
Design and electrical characterization of RF devices (FET, bipolar, diodes, passives), conduct theoretical studies and simulations to optimize device performance, execute DOE and analyze results, establish new technology design rules and test methodologies, partner with unit process and failure analysis teams to improve yield, drive technical process problem solving
Seniority
Principal, hands-on IC with strategic oversight
