Substrate Process & Test Technology Development
Core
Lead development, qualification, and manufacturing enablement of next-generation substrate technologies for AMD's advanced packaging roadmap, driving technology maturity from concept to high-volume production.
Role type
Senior IC substrate process and test technology development engineer
Builds
Advanced package substrates and test vehicles for AMD processors and AI products
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
substrate manufacturing processes, test methodologies, materials interactions, process integration, failure analysis, yield engineering, technology qualification, statistical process control, defect reduction, reliability physics, supplier management
Preferred skills
ABF substrates, advanced HDI technologies, fine-line processes, advanced via structures, manufacturing ramp support, executive communication
Technologies
ABF, HDI, imaging, lamination, via formation, metallization, plating
Responsibilities
Lead development and qualification of advanced package substrate technologies; Drive process integration across substrate manufacturing flows; Define substrate test vehicle strategies and characterization methodologies; Drive yield learning activities and root-cause analysis for manufacturing excursions; Develop qualification plans and reliability assessment methodologies; Engage substrate suppliers and OSATs to develop process innovations
