Mechanical Engineer
Core
Develop mechanical solutions for advanced semiconductor packages and cooling systems to enable AI, HPC, FPGA, ASIC, and SoC products.
Role type
Senior IC mechanical engineer (semiconductor packaging)
Builds
Next-generation packaging and cooling solutions for industry-leading AI and HPC products
Domain
Semiconductor manufacturing and advanced packaging
Required skills
Semiconductor packaging experience, mechanical design, CAD modeling, GD&T, tolerance analysis, DFM, thermo-mechanical modeling, chip-package interaction, supplier engagement, advanced cooling solutions
Preferred skills
Experience with advanced cooling solutions, thermal technologies, or emerging packaging materials
Technologies
Creo, ANSYS Mechanical
Responsibilities
Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews; Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions; Review and evaluate mechanical designs, simulations, and engineering changes; Support thermo-mechanical modeling and package integration activities; Contribute to chip, package, board, and system-level integration efforts.
Seniority
Senior, hands-on IC
