Principal Engineer, Package Integration and Manufacturability
Core
Lead packaging, technology, and manufacturability for next-generation networking products, focusing on chiplet integration, 2.5D interposers, and co-packaged optics.
Role type
Principal Engineer, Package Integration and Manufacturability
Builds
Advanced networking devices and modules
Domain
Semiconductor packaging and networking hardware
Required skills
Package technology development, system integration, 2.5D/Chiplet/Organic substrate integration, Assembly and module yield mechanics, Design for manufacturability (DFM), Co-design approaches, Risk assessment, Yield analysis
Preferred skills
Assembly floor/foundry/OSAT experience, Co-packaged optics/photonic packaging, Design-for-manufacturability in early architecture, Large high-end ASICs/multi-die modules
Technologies
Chiplet integration, 2.5D interposers, Co-packaged optics, Organic substrates
Responsibilities
Lead technical assessment of package risk across chip programs, Drive new approaches to manufacturability across package/substrate/interposer/silicon, Analyze module yield mechanics and convert findings into design guidance, Evaluate emerging packaging and photonics technologies
Seniority
Principal, hands-on IC with strategic influence
