Senior Package Engineer
Core
Leading the development of complex, top-of-the-line ASIC packages for Nvidia Networking Business Unit's future products.
Role type
Senior IC package engineer (microelectronics)
Builds
ASIC packages for networking products
Domain
Semiconductor manufacturing / microelectronics
Required skills
complex process development (warpage, heat, optics, adhesives), vendor collaboration, failure analysis, production support, project planning, cost resolution, electrical design issue resolution
Preferred skills
semiconductor manufacturing processes, optical systems, packaging development
Technologies
ASIC, warpage, heat, optics, adhesives
Responsibilities
Lead development of groundbreaking microelectronics packaging; Collaborate with vendors to develop ambitious packaging solutions; Lead task forces for production excursions and failure analysis; Provide failure investigations and production support for high volume products
Seniority
Senior, hands-on IC
