Sr. IC Package Design Engineer (Silicon Engineering)
Core
Developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures, specifically leading packaging for custom in-house ASICs and RFICs for digital beam formers and modems.
Role type
Senior IC Package Design Engineer (Silicon Engineering)
Builds
Custom in-house ASICs and RFICs for digital beam formers and modems
Domain
Aerospace / Satellite Communications / Silicon Engineering
Required skills
IC package design, BGA configuration, package structure design, package/SIP layout, design verification, tapeout, cross-functional coordination, silicon floor plan optimization, bump and package pin out design, signal integrity (SI) simulation, power integrity (PI) simulation, RF performance optimization, design methodology development, Co-packaged Optics (CPO) experience, substrate design for RF/digital/high-speed/mixed-signal die, Cadence APD+/SIP tool proficiency, SI/PI and EM simulation (SIWave, HFSS, ADS), BGA package substrate technology knowledge
Preferred skills
Co-packaged Optics (CPO), signal and power integrity fundamentals, substrate design for RF/digital/high-speed/mixed-signal die, Cadence APD+/SIP, package design electrical review, SI/PI analysis, SI/PI and EM simulation tools (SIWave, HFSS, ADS), package design for manufacturing reviews, BGA package substrate technologies
Technologies
Cadence APD+/SIP, SIWave, HFSS, ADS
Responsibilities
Own and drive advanced package selection, new product BGA configuration and package structure; Responsible for package/SIP layout, optimization, design verification and tapeout; Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design; Work cross-functionally to understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out; Simulate and optimize signal/power integrity and RF performance of the package design; Drive methodology, innovations, and productivity improvements in package design
Seniority
Senior, hands-on IC
