Staff Process Technology Integration Engineer
Core
Interface with HBM vendor and wafer fab teams to resolve silicon manufacturing issues impacting yield, reliability, and performance of AMD's AI products and processors.
Role type
Staff Process Technology Integration Engineer
Builds
High Bandwidth Memory (HBM) and logic processor chips for AI and high-performance computing
Domain
Semiconductor manufacturing (HBM/DRAM and logic)
Required skills
Process integration (FEOL/MEOL/BEOL), yield analysis, defect analysis, parametric signature review, failure mechanism deduction, process improvement evaluation, cross-functional stakeholder management
Preferred skills
Experience across multiple technology nodes, HBM/DRAM or FinFET fabrication knowledge, PFA and FI techniques, unit process module expertise
Technologies
HBM, DRAM, FinFET, FEOL, MEOL, BEOL, WAT, PFA, FI
Responsibilities
Provide expertise in process and integration for advanced Front/Middle/Back End Of line modules; Review systematic defect and parametric signatures with vendors; Jointly design and analyze process improvement evaluations; Perform hands-on product yield analysis and foundry WAT/electrical test parameter analysis; Collaborate with device analysis teams to deduce process failure mechanisms; Interface with supplier quality and reliability engineering teams; Maintain the overall F/M/BEOL technology encyclopedia; Keep abreast of industry trends in wafer fab process integration
Seniority
Staff, hands-on IC with strategic influence