Product Development Engineer – Thermal Engineering
Core
Drive thermal characterization, validation, and technology development for advanced semiconductor package architectures and next-generation products.
Role type
Senior IC thermal engineer (advanced packaging)
Builds
Cutting-edge semiconductor packages and next-generation computing products
Domain
Semiconductor / Advanced Packaging / Thermal Management
Required skills
Thermal characterization, heat transfer principles, thermal modeling, simulation correlation, root-cause analysis, TTV development, data analysis
Preferred skills
Semiconductor packaging experience, NPI support, OSAT engagement, troubleshooting, cross-functional collaboration
Technologies
Thermal Test Vehicles (TTVs), simulation tools, laboratory testing equipment
Responsibilities
Lead thermal characterization activities including TTV development and validation; Develop thermal models and correlate with lab measurements; Investigate thermal issues and drive corrective actions; Support qualification and manufacturing transfers with OSAT partners; Contribute to future technology pathfinding.
Seniority
Senior, hands-on IC
