3D IC and ADVANCED PACKAGING CAD ENGINEER
Core
Develop automated environments and AI-driven flows for 3D-IC stack generation, validation, and SoC construction.
Role type
Senior IC CAD Engineer (3D-IC & AI)
Builds
Automated 3D-IC design flows, AI/ML optimization tools, and agentic systems for silicon design.
Domain
Semiconductor / 3D-IC Design / EDA / AI
Deliverable
production ML models
Required skills
3D-IC design, EDA toolchains (Synopsys, Cadence), Machine Learning, LLM integration, Python, TCL, Perl, Verilog, RTL, UPF
Preferred skills
Advanced packaging technologies, distributed/cloud compute environments, agentic AI frameworks
Technologies
Synopsys 3DIC Compiler, Cadence, Python, TCL, Perl, Linux/Unix, Verilog, RTL, UPF
Responsibilities
Implement and maintain 3D-IC design flows from RTL through signoff; Develop and integrate end-to-end AI capabilities into CAD flows; Build and deploy agentic AI systems for design automation; Partner with EDA vendors on feature requirements and AI co-development; Define strategy for future design requirements and technology nodes; Analyze results to improve quality of results (Timing, Area, Performance).
Seniority
Senior, hands-on IC
