Technical Fellow - High-Speed Interconnect & Optics
Core
Define and advance system-level interconnect architecture for next-generation AI, HPC, and data center platforms, driving innovation across electrical and optical technologies including ASICs, advanced packaging, boards, optics, and full-system integration.
Role type
Senior IC Technical Fellow (High-Speed Interconnect & Optics)
Builds
Next-generation AI, HPC, and data center platforms with scalable interconnect solutions
Domain
Semiconductor / High-Speed Interconnect / Optics / Silicon Photonics
Required skills
High-speed signal integrity (SI) and power integrity (PDN) design, Optical system integration and packaging, Silicon photonics and laser integration, SerDes architecture and channel modeling, System-level bring-up and debug, Industry standards development (OIF, IEEE, PCI-SIG), Technical mentorship and strategy
Preferred skills
Pluggable optics (QSFP, OSFP), Co-Packaged Optics (CPO), Co-Packaged Copper (CPC), On-Board Optics (OBO), Thermal and power optimization at scale, Publications and patents
Technologies
ASICs, 112G/224G+ interfaces, QSFP/OSFP, CPO, CPC, OBO, SerDes, Silicon Photonics
Responsibilities
Provide technical authority in high-speed SI/PI and PDN design across ASICs, packages, and boards; Drive end-to-end optical system integration including silicon photonics and laser coupling; Influence SerDes architecture and tuning strategies; Serve as hands-on technical authority for lab bring-up, characterization, and system debug; Represent AMD in industry standards bodies to shape specifications; Mentor senior engineers and establish architectural frameworks; Act as trusted technical advisor for product strategy and vendor decisions
Seniority
Senior, hands-on IC technical leader
