Account Technologist (PVD Advanced Packaging)
Core
Technical owner for PVD solutions at OSATs and Fabless accounts, enabling next-gen advanced packaging solutions.
Role type
Senior Account Technologist (PVD Advanced Packaging)
Builds
Executable PVD solutions for OSATs and Fabless packaging architectures
Domain
Semiconductor equipment / Advanced Packaging
Required skills
PVD process engineering, Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM), OSAT/Fabless engagement, Process Qualification (POR), Tool Acceptance (FAT/SAT), Yield Stabilization, Reliability Testing (JEDEC/IPC), Root Cause Analysis, Cross-functional collaboration
Preferred skills
Hybrid bonding, Chiplet integration, APAC OSAT ecosystem knowledge, SPC/DOE/Metrology/Yield analytics, Thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co)
Technologies
PVD equipment, SPC, DOE, Metrology tools, JEDEC/IPC standards
Responsibilities
Act as technical owner for PVD solutions at assigned OSATs and Fabless accounts; Partner with Fabless packaging architects to define material stacks and integration flows; Lead joint qualification programs involving Fabless and OSAT stakeholders; Establish process-of-record (POR) for advanced packaging applications; Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites; Validate PVD film integrity under Fabless-driven reliability tests; Coordinate with Product Engineering, Field Service, and Quality teams; Resolve integration challenges across packaging flows; Lead structured root cause analysis on yield/reliability excursions
Seniority
Senior, hands-on IC