Advanced Packaging Process Engineer III (E3)
Core
Design, analyze, and troubleshoot advanced packaging process experiments and hardware for semiconductor and PCB applications.
Role type
Senior IC process engineer (advanced packaging)
Builds
Advanced packaging solutions for semiconductor chips and displays
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
complex problem solving, Root Cause Analysis, film property measurement, vendor management, process development, tool operation, W2W and D2W bonding expertise
Preferred skills
lead project teams, serve as resource for junior colleagues
Technologies
W2W bonding, D2W bonding, analytical instrumentation
Responsibilities
Design and execute process engineering experiments, perform hardware characterization, troubleshoot complex process issues, measure film properties, generate technical documentation, communicate with customers to resolve issues, select and partner with vendors, implement new technology and instrumentation
Seniority
Senior, hands-on IC