Manager, Process Engineer (Deposition)
Core
Lead the development and scaling of next-generation advanced packaging technologies and resolve complex process engineering issues for semiconductor customers.
Role type
Manager, Process Engineer (Deposition)
Builds
Next-generation advanced packaging technologies, 3D integration, and related semiconductor applications
Domain
Semiconductor manufacturing, advanced packaging, thin-film deposition
Required skills
Thin-film deposition (PVD, CVD, ALD), Advanced packaging (TSV, hybrid bonding, wafer-level packaging), Process integration, Hardware characterization, Team management, Strategic roadmap development
Preferred skills
Materials engineering, Cross-functional collaboration, Customer interaction, Market share improvement
Technologies
PVD, CVD, ALD, TSV, Hybrid bonding, Wafer-level packaging
Responsibilities
Lead development and scaling of advanced packaging technologies; Drive process and technology roadmap development; Manage engineers in hardware characterization; Interact with key customers to resolve complex process engineering issues; Ensure effective product/technology demonstrations; Lead collaboration efforts with executive and junior managers; Lead market share improvement efforts
Seniority
Manager, strategic execution & team leadership