Senior Engineer, Process Engineering (ALD Advanced Packaging)
Core
Lead the development and optimization of advanced Atomic Layer Deposition (ALD) processes for next-generation semiconductor applications, translating complex process challenges into manufacturable solutions.
Role type
Senior IC process engineer (ALD)
Builds
Advanced packaging solutions for semiconductor manufacturing
Domain
Semiconductor manufacturing / Advanced packaging / Atomic Layer Deposition
Required skills
ALD process development, experimental design, complex data analysis, semiconductor physics, process equipment operation, technology transfer, cross-functional collaboration
Preferred skills
Thesis in ALD, experience with AFM/XRD/TEM/SIMS/ellipsometry, knowledge of advanced chemistries
Technologies
AFM, XRD, TEM, SIMS, ellipsometry, thermal ALD, PEALD
Responsibilities
Research, develop, and optimize ALD processes; conduct experiments and analyze complex data sets; demonstrate innovative solutions in high-volume manufacturing context; stay updated on state-of-the-art ALD applications; work hands-on with semiconductor process equipment; communicate with R&D teams and customers; perform demonstrations and knowledge transfer to support product transfers.
Seniority
Senior, hands-on IC