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Manager II, Field Process (Technical Manager)

ID Boise (ASM America Inc.)💼 Full-time🗓 2026-07-30 → 2026-09-26

Core

Lead customer process engagement, new product introduction (NPI), and transition to high volume manufacturing (HVM) for semiconductor deposition processes.

Role type

Senior IC Technical Manager (Field Process)

Builds

Semiconductor deposition processes and equipment for memory and advanced packaging applications

Domain

Semiconductor manufacturing equipment (Thin-film processes: PEALD, PECVD, LPCVD, ALD, Epitaxy, Vertical Furnace)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thin-film process expertise, NPI and HVM execution, process optimization, technical escalation management, team leadership, cross-functional collaboration, project management, analytical problem-solving

Preferred skills

Memory (DRAM/Advanced Memory) and/or Advanced Packaging experience, semiconductor equipment supplier background, strong business acumen

Technologies

PEALD, PECVD, LPCVD, ALD, Epitaxy, Vertical Furnace

Responsibilities

Develop strong customer relationships as a trusted technical advisor; Lead field process teams in process development, qualification, and troubleshooting; Drive NPI programs through qualification to HVM adoption; Manage critical customer escalations and ensure timely resolution; Recruit, mentor, and develop high-performing process engineers; Partner with R&D, Product Engineering, and Sales to execute technology programs.

Seniority

Senior, hands-on IC with team leadership

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