Process Engineer-Shanghai/Hangzhou/Hefei/Nanjing/Suzhou/Wuxi
Core
Designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies, specifically advanced packaging.
Role type
Senior Process Engineer (Advanced Packaging)
Builds
Advanced packaging modules and FabVantage value-added solutions for semiconductor and display customers
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging process expertise, CMP/Etch knowledge, HBM/2.5D/3D packaging, high-density interconnects, data analytics, DOE, statistical analysis, root cause analysis, hardware characterization
Preferred skills
AIx databases, digital FabVantage platforms, JMP, Applied Pro, complex problem solving, technical presentation
Technologies
JMP, FSS, AIx, Applied Pro, FabVantage
Responsibilities
Lead advanced packaging process engagements with China-based customers, identify and resolve high-value process/integration issues, define best practices for advanced packaging modules, document findings and deliver technical reports, characterize hardware on complex systems, develop and execute process engineering projects, communicate with customers to resolve complex issues
Seniority
Senior, hands-on IC