Process Engineer II - Office of the CTO
Core
Designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies, specifically advanced packaging.
Role type
Process Engineer (semiconductor packaging)
Builds
Laboratory-scale processes for advanced packaging technologies
Domain
Semiconductor manufacturing / Display technology
Required skills
Semiconductor packaging, Semiconductor fabrication, Lithography, Wet chemical etch/clean, Dry film lamination, Hardware characterization, Root Cause Analysis, Data analysis, Film property measurement, Vendor management
Preferred skills
Lithography process engineering experience
Technologies
Photolithography equipment, Analytical instrumentation
Responsibilities
Conduct lab-based experiments to evaluate and improve advanced packaging processes; Develop, optimize, and sustain photolithography processes; Design, collect data, analyze and compile reports on process engineering experiments; Perform hardware characterization on complex systems; Troubleshoot complex problems and perform Root Cause Analysis; Generate internal and external technical documentation; Interact with customers to resolve process engineering issues; Measure film properties and interpret data; Identify, select and work with vendors and suppliers; Implement new technology, products and analytical instrumentation
Seniority
Mid-level, hands-on IC