精密制造技术工程师（封装工艺）
Core
Develop and maintain SiP packaging processes and advanced packaging technologies to ensure stable mass production.
Role type
Senior IC packaging process engineer (SiP/advanced packaging)
Builds
SiP modules and advanced packaging solutions for semiconductor clients
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
SiP packaging process expertise, DOE experimental design, SPC/FDC data-driven control, failure analysis (SEM/TEM/X-Ray), 6 Sigma quality engineering, Minitab/JMP statistical tools
Preferred skills
Semiconductor physics and materials knowledge, cross-functional collaboration, complex problem-solving
Technologies
Minitab, JMP, SPC, FDC, SEM, TEM, X-Ray
Responsibilities
Import new packaging technologies and establish SOPs; lead process optimization projects to improve efficiency and reduce costs; troubleshoot technical issues to enhance yield and reliability; build quality control systems using SPC and FDC; collaborate across departments to resolve production anomalies
Seniority
Senior, hands-on IC
