Process Integration Engineer
Core
Lead process integration for advanced semiconductor and photonic devices, enabling next-generation high-performance interconnect technologies.
Role type
Senior IC process integration engineer
Builds
Robust, manufacturable process flows for semiconductor and display chips
Domain
Semiconductor manufacturing / Materials science
Required skills
Semiconductor process integration, Lithography, Etch, Thin film deposition, Metallization, Implant, CMP, Yield analysis, Metrology, SPC implementation, Simulation tools (Cadence, KLayout, COMSOL, ANSYS)
Preferred skills
Photonic devices, Co-packaged optics (CPO), Advanced packaging, Heterogeneous integration
Technologies
Cadence, KLayout, AutoCAD, SolidWorks, COMSOL, ANSYS
Responsibilities
Lead process integration for advanced semiconductor and photonic devices, Translate device architectures and design layouts into robust, manufacturable process flows, Drive C&F activities including proof-of-concept and prototyping builds, Define and track critical process parameters and integration metrics, Own end-to-end integration flow execution, Drive yield improvement, SPC, and CIP across complex fabrication flows, Conduct optical, electrical, and tolerance analyses, Collaborate cross-functionally with process engineering, product development, design, and production teams
Seniority
Senior, hands-on IC