AI芯片互联技术探索（AI芯片） - 芯片研发
Core
Exploring new technologies for AI chip Scale Up and Scale Out interconnect, identifying bottlenecks, and solving key problems to support high-performance AI chip and SoC solutions.
Role type
Senior IC AI chip interconnect research engineer
Builds
High-performance AI chips and SoCs for cloud and edge scenarios
Domain
Semiconductor / AI Hardware / High-performance Computing
Deliverable
production ML models
Required skills
PhD in Microelectronics or Computer Science, Scale Up/Scale Out protocol expertise, hardware-software co-design, AI training/inference parallelism, communication topology modeling, performance analysis
Preferred skills
Full project lifecycle experience (research to product), quantitative analysis for optimization, cutting-edge research experience, paper publications
Technologies
AI chip interconnect protocols, simulation tools, performance modeling frameworks
