【群馬】半導体後工程 量産技術者
Core
Lead assembly technology for FCBGA and WLCSP semiconductor packages, covering development validation, mass production yield/cost/quality improvement, and defect resolution.
Role type
Senior IC manufacturing technology specialist (semiconductor packaging)
Builds
FCBGA and WLCSP semiconductor packages for automotive and embedded applications
Domain
Semiconductor manufacturing / Automotive electronics
Required skills
Semiconductor back-end assembly knowledge, Yield improvement, Quality improvement, Cost reduction, Defect analysis, Cross-functional coordination, English communication, Japanese business communication
Preferred skills
FCBGA package experience, WLCSP package experience, Overseas outsourcing coordination, Chiplet/flip-chip structure knowledge
Technologies
FCBGA, WLCSP, Chiplet, Flip-chip
Responsibilities
Conduct technical verification and review of development results, Manage assembly yield, cost, and quality improvement activities, Handle change requests and coordinate with related departments, Plan and analyze root causes for defects and coordinate with quality assurance and customers
Seniority
Senior, hands-on IC
