Engineer (Front Assembly Line)
Core
Develop, optimize, and qualify robust semiconductor assembly processes for packages from wafer preparation to final cleaning to ensure quality, reliability, and productivity.
Role type
Senior IC process development engineer (semiconductor assembly)
Builds
New semiconductor packages (power discrete, MOSFET) for automotive, industrial, infrastructure, and IoT markets
Domain
Semiconductor manufacturing / Power electronics
Required skills
Semiconductor assembly process development, DOE, SPC, FMEA, root cause analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor packaging experience, JMP software for DOE, RPA (Power Automate), failure analysis techniques
Technologies
Plasma cleaning, Wire bonding, AP coating & bake, JMP, Power Automate
Responsibilities
Develop and optimize assembly process conditions for new products; Execute process development plans and qualification builds; Collaborate with production, equipment, and quality teams; Prepare process specifications, SOPs, and risk assessments; Support safe launch and mass production transfer.
Seniority
Mid-to-Senior, hands-on IC