Sr Staff Packaging Product Engineer
Core
Design, develop, and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost, and mass production robustness.
Role type
Sr Staff Packaging Product Engineer
Builds
Advanced high power discrete, multi-chip, stacked, and module packages for automotive and industrial applications
Domain
Semiconductor packaging and power electronics
Required skills
Semiconductor packaging technology, Design for manufacturability (DFM), Thermal-mechanical analysis, Process Design of Experiments (DOE), Reliability testing and qualification, Supply chain management, Statistical process control (SPC), Project management, Cross-functional collaboration, OSAT vendor management
Preferred skills
Experience with Ag sintered die bonding, Flip chip LGA and QFN technologies, Low stress vacuum molding, IC packaging design rules, Simulation software (thermo-mechanical, thermal, electrical), Automotive development processes (APQP, AEQ)
Technologies
AutoCAD, SAS, JMP, Mini Tab, Sapphire substrate, Conductive/nonconductive die attach films, Ag sintered epoxies, Ribbon wire bonding, High CTI/high thermal molding compounds
Responsibilities
Define package design rules, process flow, and material sets; Analyze stress, thermal capability, and electrical performance; Run process DOE's to define optimum process windows; Resolve package reliability and assembly issues with OSATs; Drive reliability testing and qualification plans; Manage technical project timelines and material readiness; Transfer NPI knowledge to sustaining teams; Collaborate on packaging roadmap aligned with product strategy
Seniority
Sr Staff, hands-on IC
