半導体組立工程 技術開発エンジニアシニアエンジニア
Core
Senior IC engineer leading technical development for advanced semiconductor assembly and packaging processes (SMT, SPI, AOI, Flip Chip bonding, Flux cleaning) for AI, HPC, automotive, and IoT markets.
Role type
Senior IC semiconductor assembly and packaging process engineer
Builds
High-density, high-reliability, and high-thermal-conductivity semiconductor packages (VPS, FCCSP, FCBGA)
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor back-end assembly and packaging technical development, SMT/SPI/AOI/Flip Chip bonding/Flux cleaning process development, Process improvement and yield enhancement, Equipment selection and implementation, Production line launch and mass production transition support, Quality management
Preferred skills
Failure analysis using FTA and 5Why, Material selection and optimization, CAD design for fixtures and tools, Knowledge of IATF and JEDEC standards, Product management experience
Technologies
SMT, SPI, AOI, Flip Chip bonding, Flux cleaning, VPS, FCCSP, FCBGA, CAD
Responsibilities
Develop assembly technologies for advanced packages, Select and introduce equipment, Improve materials and processes, Support production line launch and mass production, Improve process quality and yield
Seniority
Senior, hands-on IC
