Semiconductor Assembly Process Technology Development Senior Engineer
Core
Develop and implement assembly technologies and processes for advanced semiconductor packages (Flip Chip, SiP, VPS, FCCSP, FCBGA) serving AI, HPC, automotive, and IoT markets.
Role type
Senior IC semiconductor assembly process technology development engineer
Builds
Next-generation semiconductor packages with higher density, improved thermal performance, and greater reliability
Domain
Semiconductor manufacturing (back-end assembly and packaging)
Required skills
Semiconductor assembly and packaging process development, equipment selection and implementation, SMT/SPI/AOI/Flip Chip bonding/Flux cleaning process optimization, process quality and yield improvement, mass production line transition support
Preferred skills
Defect analysis using FTA/5Whys, materials development and optimization, CAD design for jigs and tools, knowledge of IATF and JEDEC standards, product development project management
Technologies
VPS, FCCSP, FCBGA, Flip Chip, SMT, SPI, AOI, Flux cleaning
Responsibilities
Develop and improve materials and processes for assembly, support launching and transitioning to mass production lines, conduct process quality and yield improvement activities
Seniority
Senior, hands-on IC
