Staff Process Engineer
Core
Design and qualify assembly processes for Power QFN packages and Cu Clip thin die assemblies for Smart Power Stage (SPS) products.
Role type
Staff Process Engineer (Assembly & Package Development)
Builds
PQFN packages and associated modules for automotive, industrial, and IoT applications
Domain
Semiconductor manufacturing, power electronics, thin wafer handling
Required skills
Assembly engineering, process engineering, package development, thin wafer handling, SPS solder attach, wire bonding, quality/reliability standards, SPC/statistical analysis, supplier management, NPI-to-production transfer
Preferred skills
Cu Clip technology, Taiko wafer technology, mass production support, change management (via careerplan.io/jobs/744000153483194-staff-process-engineer-at-renesas-electronics)
Responsibilities
Design and develop qualification processes for PQFN packages; ramp up manufacturing volume and qualify sources; sustain production lines and improve yield/capacity/quality/costs; address customer feedback with cross-functional teams; manage Product Lifecycle Management documents; conduct change management with suppliers; partner with Quality and Reliability teams; serve as manufacturing engineering interface for NPI transfers; manage OSAT and contract manufacturing relationships