Manager, Semiconductor IC Packaging & Assembly Engineering
Core
Manager of Semiconductor IC Packaging Assembly Engineering supporting assembly sustaining engineering, manufacturing execution, and NPI-to-HVM transfers for advanced power packaging and wide-bandgap technologies.
Role type
Manager, Semiconductor IC Packaging & Assembly Engineering
Builds
Advanced semiconductor packages (Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET) using SiC/GaN, DBC, and AMB substrates for AI/data center infrastructure and power applications.
Domain
Semiconductor Manufacturing / Power Electronics / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor package assembly processes (wirebond, flip chip, molding, SMT), Yield analysis & SPC, DOE, Root-cause analysis, OSAT partner coordination, NPI-to-HVM ramp execution, Process change management, Quality systems (JEDEC/IPC)
Preferred skills
Advanced packaging (2.5D/3D, fan-out, heterogeneous integration), Automotive/AI/High-performance computing domain knowledge, Geographically distributed team management, Reliability standards (JEDEC, IPC)
Technologies
SiC, GaN, DBC, AMB, Wirebond, Flip chip, Wafer-level packaging, Multi-chip modules, SMT
Responsibilities
Execute sustaining engineering activities for assigned product lines; Monitor assembly yield performance and drive continuous improvement; Support process change management and qualification plans; Coordinate NPI-to-HVM transfers with engineering and supply chain; Manage technical coordination with global OSAT partners; Provide technical guidance to engineering team members.
Seniority
Manager, hands-on technical leadership
