Mold Process Engineer
Core
Develop, optimize, and control molding processes to ensure high product quality, yield, and manufacturing efficiency for semiconductor packaging.
Role type
Mold Process Engineer
Builds
Semiconductor packages and components
Domain
Semiconductor manufacturing / Injection molding
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process specification development, FMEA, Control Plans, DOE, SPC, 8D problem-solving, RCA, Six Sigma, mold compound evaluation, troubleshooting
Preferred skills
Semiconductor packaging experience, transfer molding expertise
Technologies
Transfer molding, compression molding, injection molding
Responsibilities
Develop and maintain process specifications, work instructions, FMEA, Control Plans, KPIV/KPOV, and troubleshooting guides; Support continuous improvement, cost reduction, automation, and productivity initiatives; Evaluate new mold compounds, mold tooling, and process technologies for reliability and manufacturability; Collaborate with equipment, quality, maintenance, and production teams to implement corrective and preventive actions for quality issues and customer complaints; Support new package and product qualifications, process transfers, and customer requirements.
