TW_汽車電子封裝_Packaging Development Engineer (ASIC)
Core
Define, develop, and qualify robust automotive-grade ASIC packaging solutions while acting as the technical bridge between internal teams and external assembly/test suppliers.
Role type
Semiconductor Packaging Engineer (Automotive ASIC)
Builds
Automotive-grade ASIC products
Domain
Semiconductor packaging for automotive applications
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging design, material selection, assembly process optimization, FMEA, supplier management, NPI process qualification, automotive standards compliance (AEC-Q100, Q006), legacy wire-bond technologies, flip-chip, advanced packaging (QFN, QFP, SOIC, BGA, SiP), analytical problem-solving
Preferred skills
None stated
Technologies
QFN, QFP, SOIC, Flip-chip, BGA, SiP, AEC-Q100, AEC-Q006
Responsibilities
Drive package design and process development with external suppliers; Participate in design risk reviews and FMEAs; Manage OSAT partners for manufacturing oversight and quality control; Monitor prototyping runs and formal qualifications; Align packaging requirements with international design and quality teams
Seniority
Mid-level, hands-on IC
