Academic Internship in Mechanic or Materials Engineering (f/m/div.)
Core
Investigate failure mechanisms in System in Packages (SIP) modules caused by thermal-mechanical loads and create design rules to mitigate them.
Role type
Academic Intern, Materials/Mechanic Engineering
Builds
Design rules for SIP components and manufacturing solutions
Domain
Automotive Electronics / Semiconductor Packaging
Required skills
Material properties analysis, Thermal-mechanical damage assessment, Experimental design, Data analysis, Statistical treatment, Simulation tools usage, MBE (Model Based Engineering)
Preferred skills
Reflow process knowledge, Design parameter optimization
Technologies
Simulation tools, MBE model
Responsibilities
Review literature and Bosch SIP documents, Collect data from Bosch Plants, Analyze thermal-mechanical mechanisms, Propose design elements and manufacturing solutions, Use simulation tools to support design decisions
Seniority
Intern
