半導体後工程アセンブリエンジニア
Core
Semiconductor post-process assembly engineer specializing in wire bonding evaluation and improvement for automotive and electronic control units.
Role type
Senior IC semiconductor assembly engineer (wire bonding)
Builds
High-performance LSI chips for automotive and industrial applications
Domain
Semiconductor manufacturing / Automotive electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wire bonding equipment operation, wire bonding process knowledge, process condition evaluation, report creation and reporting, post-process assembly workflow understanding
Preferred skills
Automation knowledge (AMR, AI)
Technologies
Wire bonding equipment, AMR, AI
Responsibilities
Evaluate and improve wire bonding processes, support product launches, collaborate with cross-functional departments for production efficiency
Seniority
Mid-level to Senior, hands-on IC
