TW_感測器研發_Packaging Development Engineer
Core
Design and optimize packaging and assembly processes for MEMS electronic sensors in automotive and consumer-electronics acoustic applications.
Role type
Packaging Development Engineer (MEMS)
Builds
Electronic sensors for automotive and consumer electronics
Domain
Micro-Electro-Mechanical Systems (MEMS), Acoustics, Automotive, Consumer Electronics
Deliverable
production ML models | product features | infrastructure
Required skills
MEMS packaging design, assembly process development, LGA, BGA, DFN, WLCSP, SiP, micro-phone assembly, supplier management, process qualification
Preferred skills
Acoustic device development, assembly technology background
Technologies
LGA, BGA, DFN, WLCSP, SiP
Responsibilities
Package design and process development in cooperation with suppliers and product engineering, Develop and optimize assembly processes for MEMS, Oversee sample manufacturing and process qualification at assembly partners
Seniority
Mid-level (3-8 years experience)
