Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing) Singapore, Singapore
Core
Drive manufacturing test flow development, validation, and yield improvement for next-generation High Bandwidth Memory (HBM) products including DRAM, interface, and stacked die.
Role type
Senior IC semiconductor product & system engineer (manufacturing test)
Builds
High-volume manufacturing test flows and validated HBM products
Domain
Semiconductor manufacturing (HBM/DRAM)
Required skills
CMOS technology, DRAM architecture, device physics, root cause analysis, circuit debug, test coverage optimization, Python, JMP, project management, technical decision making
Preferred skills
Semiconductor device coursework, internship in circuit design or product validation, data analysis and statistics
Technologies
Python, JMP, CAD tools, Verilog
Responsibilities
Develop and validate manufacturing test flows for HBM architectures; Improve device and stack-level yield; Support new product design verification using CAD and Verilog simulations; Resolve manufacturing test flow, qualification, and RMA device issues; Mentor team members; Make technical decisions on risk analysis and project prioritization; Collaborate with Fab, Design, and Technology Development teams.
Seniority
Senior, hands-on IC