Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Lead a team to develop and execute reliability test flows for High Bandwidth Memory (HBM) products, driving defect reduction and process improvements for DRAM and stacked die.
Role type
Senior IC reliability engineer (HBM product engineering)
Builds
HBM memory products (DRAM and Interface die)
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Root cause analysis, Process conversion management, Risk management, Project management, Technical decision making, Cross-functional collaboration, Machine learning (regression, classification, anomaly detection, clustering), AI tool adoption (Claude code, agentic AI), Python scripting, Data analysis, Statistics, CMOS technology knowledge, DRAM architecture knowledge, Device physics knowledge
Preferred skills
Coursework or internship in semiconductor devices, circuit design, or product validation
Technologies
Python, JMP, Claude code, agentic AI
Responsibilities
Define and develop reliability stress, test flows and test plans; Manage qualification execution progress and drive gating issue resolution; Drive down Extrinsic and Intrinsic Reliability (DPM) through optimized test strategies; Debug and identify root cause of qual and RMA failures using EFA and PFA; Provide recommendations to fab teams for new process conversions to reduce cost and increase yields; Manage risks associated with DPM process conversions; Coach engineers on AI adoption and embed AI/automation into reliability workflows
Seniority
Senior, hands-on IC with team leadership