Member of Technical Staff (MTS) – 3D NAND Process Integration Singapore, Singapore
Core
Drive 3D NAND integration and technology roadmap by bridging device concepts, materials, and process integration into manufacturable solutions using AI-enabled data analytics.
Role type
Senior IC semiconductor process integration engineer
Builds
Next-generation memory technologies and manufacturable solutions
Domain
Semiconductor manufacturing / 3D NAND / Memory
Deliverable
production ML models
Required skills
Semiconductor device physics, Process integration, Experiment design, Data analysis, Problem-solving, Cross-functional collaboration, AI/ML techniques
Preferred skills
Advanced data analytics, AI/ML techniques, Innovation mindset
Technologies
AI-enabled tools, Model-driven methodologies
Responsibilities
Drive 3D NAND integration and technology roadmap, Lead end-to-end development including learning vehicles and characterization, Solve complex integration challenges using data-driven approaches, Define and optimize module/process architecture, Collaborate across Device, Probe, Test, Design, and Operations teams, Integrate AI-assisted tools into daily work
Seniority
Senior, hands-on IC