Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND
Core
Lead process development and innovation for Next Generation NAND dry etch technology, managing equipment roadmaps and solving complex structural problems for advanced memory modules.
Role type
Principal Engineer / MTS (Member of Technical Staff) in Semiconductor Process Development
Builds
Next Generation NAND products (HAR, Tier by tier etches, WL contacts & staircase)
Domain
Semiconductor manufacturing / Memory (NAND)
Required skills
Dry etch process development, Plasma physics and chemistry, Statistical process control, Cross-functional leadership, Scalability problem solving, Equipment roadmap management, Supplier negotiation, Data analysis (SAS/Python)
Preferred skills
AI tool integration, Data science basics, Python coding
Technologies
RF sources, Pulsing schemes, SAS (JmP), Python
Responsibilities
Develop and innovate dry etch processes to meet structural and electrical specifications, Lead cross-functional teams to solve complex structural problems, Present process and technology roadmaps for current and future technology nodes, Mentor less experienced engineers, Manage powerful dry etch chambers to achieve yield targets, Lead supplier head-to-heads
Seniority
Principal, hands-on IC with mentorship (via careerplan.io/jobs/39527335-dry-etch-mtsprincipal-engineer-process-development-sg-advanced-nand-at-micron)