Senior Staff Engineer Module Package Development
Core
Lead package definition from concept to product release for AI power-supply and HPC modules, defining characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.
Role type
Senior Staff Engineer (Semiconductor Packaging)
Builds
Next-generation package concepts for AI power-supply and HPC applications
Domain
Semiconductor manufacturing / High-Performance Computing
Required skills
Semiconductor packaging and assembly expertise, Package concept definition, Simulation and hardware validation, Back-End assembly coordination, OSAT partner management, BOM and package design, Assembly technology selection, Risk and impact assessment, Market trend analysis, Competitor benchmarking
Preferred skills
Experience with AI power-supply products, Knowledge of module technologies, Technical interface with system architects
Technologies
Simulation tools, Hardware demonstrators, SMT technologies, PRP review processes
Responsibilities
Develop and define package concepts for AI power-supply products, Validate proposed package concepts through simulation and hardware demonstrators, Coordinate new package concepts with Back-End development teams and OSAT partners, Track package development projects through to final product release, Identify emerging development needs and update the package roadmap, Serve as technical point of contact for customer questions, Monitor market trends and conduct competitor benchmarking, Lead technical definition for major package projects including BOM and design, Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements, Act as key technical interface to partners and consultants on Back-End assembly technology
