Senior Staff Engineer Unit Process Development Wire Bond
Core
Develop, optimize, and improve product, package, and Wire Bond processes to ensure quality, manufacturability, and reproducibility in semiconductor assembly.
Role type
Senior Staff Engineer, Unit Process Development (Wire Bond)
Builds
Semiconductor power systems and IoT solutions
Domain
Semiconductor manufacturing / Wire Bonding
Required skills
Wire Bond process expertise, Semiconductor assembly processes, Material science, Chemical engineering principles, Analytical equipment operation, Statistical data analysis (DOE), Process control implementation, Technical documentation, Supplier collaboration, Process technology definition, Intellectual property development, Mentorship
Preferred skills
None stated
Technologies
SPC, APC, DOE, 8D, FMEA, DFMEA
Responsibilities
Develop and optimize Wire Bond processes via parameter scouting and verification; Lead development projects and complex problem-solving initiatives; Support prototype builds and knowledge transfer to Operations; Generate and maintain development documentation (PFMEA, Control Plans, etc.); Collaborate with suppliers on material and tooling qualification; Identify and develop new process technologies; Provide technical leadership and mentorship; Drive innovation through IP development.
Seniority
Senior Staff, hands-on IC with mentorship