Director Development
Core
Lead a high-performing Package Technology Development team to drive innovation from early concepts through industrialization and production for semiconductor solutions.
Role type
Director, Package Technology Development
Builds
Cutting-edge semiconductor package solutions
Domain
Semiconductor industry, Power systems, IoT
Required skills
Package definition, Concept engineering, Reverse engineering, Technology integration, Innovation and technology development, Design-to-Cost, Design-for-Manufacturing, Design-for-Quality, Time-to-Market management, Team leadership (20+ professionals), Problem-solving, Cross-functional collaboration
Preferred skills
Material engineering, Unit process engineering, Global development strategy
Technologies
Semiconductor packaging technologies
Responsibilities
Lead package development activities including concept engineering and technology integration, Build team capabilities for new package and technology concepts, Drive key development targets including Design-to-Cost and Time-to-Market, Lead problem-solving activities across development projects, Support the Development Head in defining department strategy and roadmap, Represent the Development function and collaborate with global development locations, Drive technical leadership across key package development disciplines
Seniority
Director, strategic leadership & team management