Senior Engineer Unit Process Development Singulations
Core
Develop and optimize semiconductor package singulation processes (tape-based, tapeless, laser, hybrid) to enable high-volume manufacturing.
Role type
Senior IC process development engineer (semiconductor packaging)
Builds
Scalable semiconductor package manufacturing solutions
Domain
Semiconductor industry, backend assembly and packaging
Required skills
Process parameter scouting and optimization, Process freeze, PFMEA/DFMEA/OJTI documentation, Tape-based singulation, Tapeless singulation, Laser singulation, Supplier qualification, Technology readiness assessment, Process capability improvement, Technical mentorship
Preferred skills
High-volume manufacturing environment experience, Yield improvement track record, Industry best practices benchmarking
Technologies
Tape-based singulation, Tapeless singulation, Laser singulation, Hybrid singulation
Responsibilities
Perform process development activities including parameter scouting, optimization, verification, and process freeze; Drive qualification and implementation of various singulation technologies; Support technical handover to Operations; Generate and maintain process documentation (PFMEA, DFMEA, etc.); Evaluate emerging technologies for industrial deployment; Liaise with suppliers for tooling and material qualification; Provide technical guidance and mentorship to teams.
Seniority
Senior, hands-on IC