Senior Staff Engineer / Principle Engineer (SON Package)
Core
Lead engineering activities for Molding, Mark/Trim/Form, Die/Clip Attach, Final Test, Scan, and Packing processes for SON (System on Leadframe) semiconductor packages.
Role type
Senior Staff / Principal Manufacturing Engineer (Semiconductor Packaging)
Builds
SON product packages for semiconductor customers
Domain
Semiconductor manufacturing / Power electronics packaging
Required skills
Semiconductor manufacturing process engineering, Molding process expertise, Mark/Trim/Form operations, Die Attach and Clip Attach technology, Final Test and Scan/Pack processes, Process optimization, Equipment qualification and characterization, Yield improvement, Quality control, Productivity enhancement, Cost reduction, Equipment utilization management
Preferred skills
Experience with BESI, ASM, Asahi equipment, TDSON leadframe-based packages, Solder Paste and reflow processes, Leadframe-based power package assembly
Technologies
BESI, ASM, Asahi, TDSON, Solder Paste, Reflow
Responsibilities
Lead engineering activities for Molding, Mark/Trim/Form, Die/Clip Attach, Final Test, Scan, and Packing processes for SON product; Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost; Lead process and equipment qualification and process characterization.
Seniority
Senior Staff / Principal, hands-on IC