Principal Engineer Equipment Engineering
Core
Lead a technical team to build and implement comprehensive equipment maintenance, preventive maintenance, and improvement systems for wire bond equipment to ensure high availability and reliability.
Role type
Principal Equipment Engineering Manager (Semiconductor Manufacturing)
Builds
Planned maintenance definitions, standard hardware/software governance, systematic equipment improvement, and calibration routines for wire bond machines.
Domain
Semiconductor manufacturing / Wire bond process
Required skills
Team leadership, 8D problem-solving, DMAIC methodology, risk detection and mitigation, equipment governance, competency model development, APC tool integration, TCR improvement.
Preferred skills
Mechanical/Electronics/Automation Engineering degree, cross-functional project management.
Technologies
APC tools, semi-auto integration systems, wire bond equipment.
Responsibilities
Lead a technical team to build planned maintenance definitions; Drive and gather previous maintenance improvement activities; Set and implement wire bond equipment governance direction; Setup and implement planned maintenance systematic routines; Establish and implement systematic equipment improvement, preventive maintenance, and calibration; Serve as Equipment Governance owner from conceptualization to sustaining; Monitor equipment stability by integrating equipment with APC tools; Responsible for implementing and executing equipment improvement topics to meet/exceed TCR; Responsible to develop, evaluate, and certify the Engineer and Technician team.
Seniority
Principal, hands-on IC with team leadership