Senior Staff Engineer Equipment Engineering Die Bond/ SMT
Core
Drive Die Bond/SMT planned maintenance methodology, execute equipment improvements, and manage maintenance costs to ensure optimum machine performance and reliability.
Role type
Senior Staff Engineer (Equipment Engineering - Die Bond/SMT)
Builds
High-availability equipment platforms with defined process control key numbers and optimized parts lifespan.
Domain
Semiconductor manufacturing / Power systems
Required skills
Planned maintenance definition, team leadership, Advanced Process Control (APC) implementation, EQ governance framework development, systematic troubleshooting, root cause corrective actions, mechanical/electrical engineering knowledge, SMT equipment familiarity.
Preferred skills
Die Bond process knowledge, SMT process knowledge, latest industry equipment technology familiarity.
Responsibilities
Lead maintenance teams to execute scheduled maintenance, define parts life span and consumption, implement APC key numbers at equipment platform, develop and execute EQ governance business process, drive equipment improvement culture through training and engineering solutions, execute Planned Maintenance using BE MNT methodology (NICA, PMKits, OneSAP PM).
Seniority
Senior Staff, hands-on IC